JPH0351299B2 - - Google Patents

Info

Publication number
JPH0351299B2
JPH0351299B2 JP60032702A JP3270285A JPH0351299B2 JP H0351299 B2 JPH0351299 B2 JP H0351299B2 JP 60032702 A JP60032702 A JP 60032702A JP 3270285 A JP3270285 A JP 3270285A JP H0351299 B2 JPH0351299 B2 JP H0351299B2
Authority
JP
Japan
Prior art keywords
resin
case
semiconductor device
heat sink
resin part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60032702A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61193471A (ja
Inventor
Eiji Harada
Ryuichiro Sakai
Hitoshi Matsuzaki
Kenji Hozuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3270285A priority Critical patent/JPS61193471A/ja
Publication of JPS61193471A publication Critical patent/JPS61193471A/ja
Publication of JPH0351299B2 publication Critical patent/JPH0351299B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP3270285A 1985-02-22 1985-02-22 半導体装置 Granted JPS61193471A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3270285A JPS61193471A (ja) 1985-02-22 1985-02-22 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3270285A JPS61193471A (ja) 1985-02-22 1985-02-22 半導体装置

Publications (2)

Publication Number Publication Date
JPS61193471A JPS61193471A (ja) 1986-08-27
JPH0351299B2 true JPH0351299B2 (en]) 1991-08-06

Family

ID=12366179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3270285A Granted JPS61193471A (ja) 1985-02-22 1985-02-22 半導体装置

Country Status (1)

Country Link
JP (1) JPS61193471A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4446527A1 (de) * 1994-12-24 1996-06-27 Ixys Semiconductor Gmbh Leistungshalbleitermodul
DE10340328A1 (de) * 2003-08-29 2005-03-24 Endress + Hauser Gmbh + Co. Kg Vergußschale

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59136953A (ja) * 1983-01-25 1984-08-06 Fuji Electric Co Ltd 複合素子

Also Published As

Publication number Publication date
JPS61193471A (ja) 1986-08-27

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