JPH0351299B2 - - Google Patents
Info
- Publication number
- JPH0351299B2 JPH0351299B2 JP60032702A JP3270285A JPH0351299B2 JP H0351299 B2 JPH0351299 B2 JP H0351299B2 JP 60032702 A JP60032702 A JP 60032702A JP 3270285 A JP3270285 A JP 3270285A JP H0351299 B2 JPH0351299 B2 JP H0351299B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- case
- semiconductor device
- heat sink
- resin part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
- H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3270285A JPS61193471A (ja) | 1985-02-22 | 1985-02-22 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3270285A JPS61193471A (ja) | 1985-02-22 | 1985-02-22 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61193471A JPS61193471A (ja) | 1986-08-27 |
JPH0351299B2 true JPH0351299B2 (en]) | 1991-08-06 |
Family
ID=12366179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3270285A Granted JPS61193471A (ja) | 1985-02-22 | 1985-02-22 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61193471A (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4446527A1 (de) * | 1994-12-24 | 1996-06-27 | Ixys Semiconductor Gmbh | Leistungshalbleitermodul |
DE10340328A1 (de) * | 2003-08-29 | 2005-03-24 | Endress + Hauser Gmbh + Co. Kg | Vergußschale |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59136953A (ja) * | 1983-01-25 | 1984-08-06 | Fuji Electric Co Ltd | 複合素子 |
-
1985
- 1985-02-22 JP JP3270285A patent/JPS61193471A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61193471A (ja) | 1986-08-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0922973A (ja) | 半導体装置 | |
JPH0351299B2 (en]) | ||
JPH0151058B2 (en]) | ||
JP2577639Y2 (ja) | 回路基板を有する半導体装置 | |
JPH02130866A (ja) | 半導体装置 | |
JPH02278752A (ja) | 半導体装置 | |
JPH09246430A (ja) | 半導体装置 | |
JPS58121652A (ja) | 混成集積回路装置 | |
JPS61194754A (ja) | 半導体装置 | |
JPH09237869A (ja) | 樹脂封止型パワーモジュール装置及びその製造方法 | |
JPH09275155A (ja) | 半導体装置 | |
JP2593867Y2 (ja) | 複合半導体装置 | |
JPH0726844Y2 (ja) | 混成集積回路 | |
JP2000252416A (ja) | 電力半導体装置 | |
JP2502577Y2 (ja) | 電力用半導体モジュ―ル | |
JP2645852B2 (ja) | 電子装置 | |
JPS60103649A (ja) | 半導体装置 | |
JPH0241865Y2 (en]) | ||
JP2605434Y2 (ja) | 複合半導体装置 | |
JPH0623254U (ja) | 基板の固定構造 | |
JPS6144438Y2 (en]) | ||
JPS6328607Y2 (en]) | ||
JPH0236281Y2 (en]) | ||
JPS62202544A (ja) | 半導体装置 | |
KR900001668B1 (ko) | 수지봉합형 반도체장치 |